The SDP Series is a two-component, room-temperature-curing silicone gap filler designed for efficient thermal management. With thermal conductivity options ranging from 1 to 5 W/mK, the series offers flexibility for a variety of applications.
Main features
- Conforms to uneven surfaces before curing and effectively fills the gaps
- Suitable for automated dispensing
- Reworkable
- High reliability and durability
Details are available in the TDS.
For further information, technical inquiries, or sample requests, please contact us through the contact form.
